전기전자/정보통신

Contents

Introduction

Application examples

(1)  Lateral resolution in in-lens SE and high angle BSE imaging at low accelerating voltages, below 2.0 kV

(2)  Z-contrast sensitivity in low-voltage, high angle BSE imaging

(3)  Information depth in low-voltage, high angle BSE imaging

(4)  Nano inclusions in Co-hardened gold plating for electronic
applications-further evidence for high lateral resolution in low-voltage,
high angle BSE imaging

(5)  A thin layer of organic contaminant on the surface of mirror-polished
Al based hard disks

(6)  A further potential of ultra-low-voltage in-lens SE imaging

(7)  Sample surface preparation by ultra-microtomy using a diamond knife for 
cross-sectional examination of various coatings on metals

(8)  Cross-sectional examination of a galvanized steel

(9)  Cross-sectional examination of a painted steel

(10)     Cross-sectional examination of solder joint of a printed circuit board

(11)     Cross-sectional examination of a tin-plated copper sheet for electronic  

 application

(12)     Cross-sectional examination of an anodized aluminum alloy for
  aerospace application

(13)     Cross-sectional examination of a porous anodic oxide film grown on a

heterogeneous Al-Fe alloy

(14)     Corrosion of an Al 2024-T3 alloy for aerospace application

(15)     Cross-sectional examination of an etched Al foil for capacitor application

(16)     On the nature of rf-GD sputtering

(17)     Precipitates in a stainless steel

(18)     Ferrite precipitates in a low-carbon stainless steel

(19)     A novel used of rf-GD sputtered surfaces for oxidation study of iron

(20)     Micro-structure of a Ti alloy

(21)     Micro-structure of a Ni-based super alloy for aerospace application

(22)     Cracks in a nitrogen-doped stainless steel

(23)     Sample surface preparation using rf-GD sputtering for cross-sectional

examination

(24)     Cross-sectional examination of a galvanized steel for car bodies

(25)     Cross-sectional examination of a flash memory device

(26)     Cross-sectional examination of a multi-layered glass

(27)     Cross-sectional examination of a copper sheet for electronic application

(28)     Cross-sectional examination of a nitride carbon steel

(29)     Cross-sectional examination of deformed surface regions of 
  carbon steel after shot peening

(30)     Cross-sectional examination of a thermal sprayed WC-18% Co coating
  on a titanium alloy

(31)     Cross-sectional examination of a thermal barrier coating on the Ni-based
  super alloy for aerospace application

(32)     On the possibility of the use of rf-GD sputtering for follow-up treatment
  of thin slices for TEM examination

Concluding remarks

About the authors